wafer machine

The drilling machine for large glass wafer processing is a production machine for silicon pressure sensors.

大片玻璃打孔机是一台硅压力传感器的生产设备.

Introduces the development of semiconductor industry, the characteristic of laser wafer dicing technology, the structure of laser wafer dicing machine, and the application in the production.

介绍了半导体行业的发展，晶圆激光划片技术的特点、激光划片系统的组成与其在实际过程中应用。

Design of the measurement and control system of quartz crystal wafer sorting machine in a π-network

π网络石英晶片自动分选机测控系统设计

The experimental study on staw wafering and its results lay an important base for designing of straw wafering machine with open end die and wafer production.

开模压饼工艺的试验研究为秸秆开模压饼机的设计以及秸秆压饼生产提供了重要依据。

Cooling Machine is used for transporting the wafer to the Cream Spreading Machine through air-cooling environment.

片冷机输送饼片往奶油涂层机,达到饼片自然冷却效果.

Wafer handling robot is automated material handling equipment used in Lithography machine which is the core of semiconductor manufacturing equipment. Its working speed, positioning accuracy, reliability, cleanliness impact on the lithography process directly in the production efficiency and manufacturing quality.

光刻机是半导体制造的核心装备，硅片传输机器人是其内部专用的自动物料处理设备，它的工作速度、定位精度、可靠性，使用洁净度等直接影响光刻工序中的生产效率和制造质量。